The UV tapes market is gaining traction as semiconductor manufacturers seek safer and more precise methods for wafer ...

Product Briefing Outline: Due to technology partnerships and longtime experience RENA has been able to optimize the handling and process sequence for the complete process chain after wafer sawing with ...

Product Briefing Outline: ACI-ecotec GmbH & Co. KG has developed a new inline wafer separation system suitable for separating mono- and polycrystalline wafers in all common formats with thicknesses of ...

TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...

As emerging technologies require ultrathinned device wafers, traditional debonding processes can pose some challenges. Photonic debonding is an innovative debonding process utilizing a carrier coated ...

Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 millimeters. The company said the newly produced wafers are half as thick as ...

U.S. researchers have developed an IR-CW laser-based method to remove backsheets from end-of-life silicon solar modules without damaging the glass or wafers, using controlled heating of the ...

Wafer chucks handle or hold wafers or substrates during wafer processing applications. They are a critical component in wafer manufacturing and testing in cleanroom fab environments. Wafer and ...

Unpatterned wafer inspection, which has flown well under the radar for most of the semiconductor industry, is becoming more critical amid the need to find defects earlier in the manufacturing process ...

A few years ago, multiple high-end companies were backing the idea of moving from 300mm to 450mm silicon wafers. Historically, moving to larger wafers was a critical way that foundries and fabs cut ...